富芮坤官方 创建的主题

@zr Great. Thanks a lot. I'm not sure if I should ask each question in a separate post or not, so for start: It seems that Dinamic Memory Allocation is not available by default, the heap memory section in the scatter file is not being recognized by the compiler due to different naming: .\Objects\ble_simple_peripheral.axf: Error: L6218E: Undefined symbol __heap_base (referred from malloc.o). .\Objects\ble_simple_peripheral.axf: Error: L6218E: Undefined symbol __heap_limit (referred from malloc.o). I tried using os_malloc() and it's not able to allocate memory and returns NULL. It seems that the heap section is not specified correctly in the scatter file. Please help me out about this issue. Thanks. According to the SDK user's guide PDF file, the maximum paired devices count is 20 in GAP bond manager, but the SDK failes for values higher than 8 and causes the application crash.